krainaksiazek advances in chemical mechanical planarization cmp 20048346

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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication - 2826988973

1216,32 zł

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication Springer, Berlin

Książki / Literatura obcojęzyczna

This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP.

Sklep: Libristo.pl

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: - 2826952196

1216,32 zł

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: Springer, Berlin

Książki / Literatura obcojęzyczna

This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP.

Sklep: Libristo.pl

Contact Stress Uniformity in CMP and Grooved Lubrication Model Problem - 2834691230

385,37 zł

Contact Stress Uniformity in CMP and Grooved Lubrication Model Problem Scholars Press

Książki / Literatura obcojęzyczna

This work includes two parts. First, we use 2D models of fluid film lubrication and contact mechanics to calculate the contact stress and fluid (i.e., slurry) pressure distributions on the wafer pad interface in chemical mechanical planarization (CMP). Our numerical results indicate that, the resulting minimum contact stress non-uniformity (NU), which directly affects the spatial uniformity of the material removal rate on the wafer surface, decreases with the effective wafer rigidity (determined by the wafer carrier structure), suggesting that it is beneficial to use a soft (e.g., floating-type) wafer carrier. For a given wafer rigidity, one may choose the retaining ring width and its back pressure, and multi-zone wafer-back pressure profile to minimize NU. Moreover, we also construct a grooved-surface fluid film lubrication model, motivated by the CMP model, to study the fluid lubrication mechanics by perturbation method. In particular, we correlate the attitude of the upper plate (representing the wafer) to the down force and moment. Our results indicate that the existence of the grooves on the lower plate will induce the upper plate to oscillate.

Sklep: Libristo.pl

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